TITLE

Designing Chiplets & 3DIC for Silicon Lifecycle Management

PRESENTER

Prof. Yervant Zorian, Synopsys, USA

DESCRIPTION

Recent advances in Artificial Intelligence accelerators, automotive systems, and high-performance computing (HPC) in data centers have led to an acceleration in the adoption of advanced chiplets and 3DIC packaging technologies. This course will present today's trends in high-end electronic systems and their needs for advanced chiplets and 3DIC systems and concentrate on the resiliency challenges and solutions for such chiplets and 3DIC systems. It will introduce the key concepts and terminology concerning the above issues, summarizing the main solutions adopted to minimize the probability of faulty circuits to reach the operational phase, and to mitigate the effects of possible faults affecting the circuits in the field.

ABOUT THE SPEAKER

Dr. Yervant Zorian is a pioneering engineer and technology leader renowned for his contributions to the fields of electronic design automation and test technologies. With a distinguished career that spans academia and industry, Dr. Zorian has made significant contributions to the development and implementation of innovative testing techniques for complex integrated circuits. As a prolific author and inventor, he has contributed to numerous publications and patents in the field. Dr. Zorian has also served in various leadership roles within professional organizations, furthering the advancement of technology and knowledge in his areas of expertise. Zorian won the 2005 Hans Karlsson Award and is a Chief Architect and Fellow at Synopsys.